As artificial intelligence workloads continue to strain traditional data center infrastructure, industry leaders like Amazon Web Services (AWS) and Equinix are turning to liquid-based cooling solutions to handle the heat generated by today’s powerful chips.
Equinix Partners with Accelsius for Advanced Two-Phase Cooling
Equinix, a global leader in data center colocation and digital infrastructure services, is set to introduce an innovative liquid cooling system developed by Accelsius. This technology—called the NeuCool IR80—will be installed at Equinix’s Co-Innovation Facility (CIF), located within its DC15 IBX data center in Ashburn, Virginia, during the third quarter of 2025.
The CIF enables Equinix to trial and showcase cutting-edge technologies alongside partners. By integrating Accelsius’ direct-to-chip two-phase cooling approach, Equinix aims to offer a practical demonstration of next-generation thermal management for clients exploring high-performance computing and AI deployments.
Accelsius CEO Josh Claman emphasized the importance of hands-on exposure, stating that many enterprises struggle to conceptualize how cooling innovations work until they see them implemented in a real environment. Notably, Accelsius’ approach allows for slightly higher coolant temperatures—6–8°C more than traditional systems—without compromising chip integrity. This design reduces reliance on energy-heavy compressors and results in more sustainable operations.
The Federal Influence: COOLERCHIPS Program
The collaboration between Equinix and Accelsius gained momentum through their participation in the U.S. Department of Energy’s COOLERCHIPS initiative. Launched in 2023, the program aims to slash data center cooling energy to under 5% of total IT power consumption—a vital target as AI expands.
AWS Develops Custom Cooling for Nvidia Blackwell Chips
Meanwhile, AWS is rolling out a bespoke liquid cooling system to support its AI infrastructure powered by Nvidia’s Blackwell GPUs—renowned for their processing capabilities and notorious heat output. The system, known as In-Row Heat Exchangers (IRHX), incorporates three main components: a water distribution system, modular fan-coil units, and a centralized pump module.
The IRHX setup utilizes cold plates that make direct contact with the processors, absorbing heat which is then transferred into circulating coolant. The heated liquid is passed through coils, which are actively cooled by fans—similar to an automotive radiator system.
What sets AWS’s system apart is its modularity. The decoupled pump design allows a single unit to manage multiple fan modules, making the system scalable and adaptable as thermal demands shift across server racks or data center locations.
An Industry-Wide Trend
Although direct-to-chip liquid cooling isn’t new—vendors such as Vertiv, Delta Electronics, CoolIT, and Motivair offer comparable technologies—the momentum behind its adoption is growing. The recent implementations by AWS and Equinix signal a shift toward liquid cooling as an essential infrastructure layer for the AI-powered future.
